Bruker Optics TriboLab CMP


TriboLab CMP

Polishing Process Control for Process Development and Materials Testing   
The new TriboLab CMP Process and Material Characterization System has been designed from the ground up specifically for reliable, flexible, and cost effective characterization of wafer polishing processes.   
  • Reproduces full-scale wafer polishing process conditions without downtime on production equipment   
  • Provides unmatched measurement repeatability and detail   
  • Allows testing on small coupons for substantial cost savings over whole-wafer testing
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