The new ZEISS FPX flat panel extension for the ZEISS Xradia Versa 500-series of 3D X-ray microscopes delivers large-sample, high throughput scanning with best-in-class image quality. Combined with the high resolution of ZEISS Xradia Versa X-ray microscopes (XRM), the new ZEISS FPX enhances imaging flexibility and creates workflow efficiencies with an all-in-one system for industrial development and academic research.
ZEISS Xradia Versa with FPX enables engineering, development and researchers to scout large samples 2-5x faster to identify a region of interest (ROI), and then zoom to image areas at high resolution with the exclusive ZEISS Xradia Versa RaaD dual magnification microscope objectives that enable resolution at a distance. ZEISS FPX extends the ability for ZEISS Xradia Versa XRM to achieve full field of view, whole-sample imaging, up to five inches in diameter for samples 10x greater in volume with higher throughput.
Howard Marks, Director of Technology Operations at the Silicon Failure Analysis Lab at NVIDIA, the world leader in visual computing solutions, said, “At NVIDIA, our goal is to achieve excellence and the highest quality of failure analysis possible for customers. We expected ZEISS FPX to deliver the excellence that allows us to continue to be tops in our field and it did. We are now able to quickly and effectively perform inspection, analysis and root cause determination in minimal time with our new ZEISS Xradia Versa with FPX. The additional capabilities enabled by ZEISS FPX give us improved response times to achieve the quality goals that keep our products the best in the world.”
ZEISS Xradia Versa with FPX offers unique capabilities in the electronics and automotive industries, where product development requires process optimization, design compliance verification and failure analysis at the system, module and component levels. With ZEISS FPX, fine details are imaged seamlessly from system to components with an all-in-one tool to enhance efficiency. Users can scan an intact device, such as a smartphone, in its entirety, then zoom to a processor or battery module, and finally to the interconnect or material structure of interest.
ZEISS Xradia Versa with FPX offers features to enhance workflows in areas such as the oil and gas and medical device industries, and for materials and life sciences. Each application field experiences a more efficient workflow with ZEISS FPX with higher quality, faster imaging when scouting and zooming interior tomographies for larger samples.
The ZEISS FPX flat panel extension is available for order with new ZEISS Xradia 510 Versa and ZEISS Xradia 520 Versa systems and as a field upgrade for all 500-series ZEISS Xradia Versa 3D X-ray microscopes.