Bruker AXS - InSight 3DAFM
Manufactured by Bruker AXS
Production-based 3D reference metrology for 45 nm and below
For unparalleled accuracy and precision – the kind needed for non-destructive, high-resolution 3D measurements of critical 45nm and 32nm semiconductor features -- the InSight™ 3D Atomic Force Microscope (AFM) is the clear choice.
InSight 3DAFM provides the accuracy needed to improve process control through critical dimension (CD) and sidewall angle (SWA) metrology.
Plus, InSight 3DAFM gives you three times the throughput and twice the measurement accuracy and precision versus previous AFMs.
InSight 3DAFM provides the accuracy needed to improve process control through critical dimension (CD) and sidewall angle (SWA) metrology.
Plus, InSight 3DAFM gives you three times the throughput and twice the measurement accuracy and precision versus previous AFMs.
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Features of InSight 3DAFM
- Provides reference metrology for crucial CD elements like gate, shallow trench isolation (STI) union dual-damascene structures, sidewall angles, line-edge variation and more.
- Provides the lowest measurement uncertainty for critical dimension (CD) and sidewall angle (SWA) metrology
- 30 wph, 9 sites throughput for Depth metrology & 12 wph, 9 sites throughput for CD metrology Unique, non-destructive, 3D Metrology (LER, LWR, SWA)
- Production level reliability and state-of-the-art automation for inline productivity
General Specifications
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