PANalytical - 2830 ZT
Manufactured by PANalytical
Advanced wavelength dispersive XRF analysis
Advanced wavelength dispersive XRF analysis
The 2830 ZT wavelength dispersive X-ray fluorescence (WDXRF) wafer analyzer offers the ultimate capability for measuring film thickness and composition. Designed specifically for the semiconductor and data storage industry, PANalytical’s 2830 ZT Wafer Analyzer enables the determination of layer composition, thickness, dopant levels and surface uniformity for a wide range of wafers up to 300 mm.
The 2830 ZT wavelength dispersive X-ray fluorescence (WDXRF) wafer analyzer offers the ultimate capability for measuring film thickness and composition. Designed specifically for the semiconductor and data storage industry, PANalytical’s 2830 ZT Wafer Analyzer enables the determination of layer composition, thickness, dopant levels and surface uniformity for a wide range of wafers up to 300 mm.
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Documents & Manuals
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Features of 2830 ZT
Continuous capability and speed
The 4 kW SST-mAX X-ray tube features groundbreaking ZETA technology which eliminates the effects of X-ray tube aging. This ‘new tube’ performance is maintained throughout the tube’s lifetime, and together with high sensitivity, ZETA technology ensures that rapid analysis and short measurement times are upheld throughout the tube’s lifetime. ZETA technology robustly reduces the need for drift correction and recalibration, which increases productivity and uptime of the instrument.
Maximized uptime
Conventional X-ray tubes suffer tungsten evaporation, which causes deposits on the inside of the tube’s beryllium window. Instrumentation using such X-ray tubes requires regular drift correction to compensate for decreasing intensity, especially for light elements.
Implementation of the SST-mAX Tube in the 2830 ZT solves this drift problem, thereby maximizing uptime and maintaining instrument precision over time.
Easy to use
The 2830 ZT is supplied with PANalytical’s advanced SuperQ software, which includes FP Multi, the software package specifically designed for multi-layer analysis. The software’s user interface ensures that even inexperienced operators can carry out fully automated fundamental parameter analysis of multi-layers.
The instrument's SuperQ software has a wide range of easy-to-use modules designed for flexible operation by researchers and engineers. Switching between recipes is easy, as is adjusting equipment parameters to suit user preferences.
FALMO-2G
The FALMO-2G easily integrates into any lab or fab: from simple manual carrier loading to full automation. A fully flexible design enables the fab manager to choose from FOUP, SMIF or open cassette load ports, with either a single or dual load port configuration. The various configurations FALMO-2G are all supported by GEM300 compliant software. The footprint of the FALMO-2G has been minimized without compromising flexibility, functionality and reliability.
General Specifications
There are no General Specifications available.
Additional Specifications
Sample handling
Wafers of 100 - 300 mm by direct loading
Maximum wafer or sample thickness 2.5 mm
FOUP, SMIF, open cassette and manual loading
Troughput up to 25 wafers per hour
X-ray tube
SST-mAX50, tapered nose, end-window tube
Measurement spot size 40 and 10 mm
Detector
Scintillation with 300 Μm Be window
Non-inflammable argon/methane
Flow counter
Sealed counter
Scanner 10 º-100 º 2Θ
Up to 24 detectors
Installation
Ambient temperature 18 - 25 °C (64 - 77 °F)
SEMI S2/S8 compliant
Full SECS/GEM compliant
