FEI Company - Helios™ PFIB DualBeam™
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Large Area Sample Preparation and Analysis in semiconductor failure analysis, process development, and process control laboratories
Large Area Sample Preparation and Analysis in semiconductor failure analysis, process development, and process control laboratories
The FEI Helios™ PFIB DualBeam™ is the world's most advanced DualBeam Plasma FIB platform for large area deprocessing to enable electrical fault isolation of advanced process ICs and advanced failure analysis of 3D packages. The Helios PFIB DualBeam system combines the innovative Helios Elstar™ with UC technology electron column for high-resolution, high-contrast imaging. Its high-performance Vion Xenon plasma ion column provides fast and precise large area sample cross-sectioning and deprocessing. Combined with FEI's proprietary Si Trenching, Dx and DE chemistries offer a unique Deprocess/Delayering solution for Electrical Fault Isolation of latest process technology devices. The Helios PFIB DualBeam also offers optional Navigation and Inspection capabilities, such as infrared/visible light microscope and analytical capabilities such as EBSD and EDX.
FEI's exclusive Plasma FIB DualBeam™ - Pushing the limits of extreme high-resolution and high-throughput characterization in 2D and 3D.
The Helios PFIB DualBeam features FEI's most recent advances in Plasma Focused Ion Beam and field emission SEM (FESEM) technologies and their combined use. FEI's first plasma-based DualBeam is designed for high-throughput, large-volume processing, combined with extreme high-resolution imaging in both 2D and 3D. For large-scale cross-sectioning, large-volume 3D data collection, or large-scale patterning, the Helios Plasma FIB DualBeam provides the highest quality of data in the shortest time.
The FEI Helios™ PFIB DualBeam™ is the world's most advanced DualBeam Plasma FIB platform for large area deprocessing to enable electrical fault isolation of advanced process ICs and advanced failure analysis of 3D packages. The Helios PFIB DualBeam system combines the innovative Helios Elstar™ with UC technology electron column for high-resolution, high-contrast imaging. Its high-performance Vion Xenon plasma ion column provides fast and precise large area sample cross-sectioning and deprocessing. Combined with FEI's proprietary Si Trenching, Dx and DE chemistries offer a unique Deprocess/Delayering solution for Electrical Fault Isolation of latest process technology devices. The Helios PFIB DualBeam also offers optional Navigation and Inspection capabilities, such as infrared/visible light microscope and analytical capabilities such as EBSD and EDX.
FEI's exclusive Plasma FIB DualBeam™ - Pushing the limits of extreme high-resolution and high-throughput characterization in 2D and 3D.
The Helios PFIB DualBeam features FEI's most recent advances in Plasma Focused Ion Beam and field emission SEM (FESEM) technologies and their combined use. FEI's first plasma-based DualBeam is designed for high-throughput, large-volume processing, combined with extreme high-resolution imaging in both 2D and 3D. For large-scale cross-sectioning, large-volume 3D data collection, or large-scale patterning, the Helios Plasma FIB DualBeam provides the highest quality of data in the shortest time.
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Features of Helios™ PFIB DualBeam™
Key Benefits
High-performance Elstar electron column with UC monochromator technology for nanometer SEM image resolution
Xenon Ion Plasma FIB column for high volume, high-speed milling and cross-sectioning
Exceptional low kV ion beam performance enables material sensitivity and low sample preparation damage
Optional MultiChem or GIS gas delivery systems provides the most advanced capabilities for electron and ion beam induced deposition and etching on DualBeams
Proprietary chemistries for deprocessing of Copper Interconnect Metallization in regular, low-k and ultra low-k dielectrics. Plasma FIB based chemistries and recipes for milling Advanced Packaging materials
Optional EasyLift nanomanipulator enables precise, site-specific preparation of large area lamellae while promoting high user confidence and yield
Five-axis, piezo-driven stage with load lock provides full coverage of up to 70 mm sampled
Backed by FEI's world class knowledge and expertise in advanced failure analysis for DualBeam applications
General Specifications
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