Designed to meet the challenges of advanced semiconductor FA labs 
 
The FEI Helios NanoLab™ 460HP DualBeam™ accurately locates the defect in repeating structures using automated sample navigation with FEI’s Cell Navigator. This improves the success rate of finding the intended region of interest by greater than 5%. In addition, the patented inverted TEM sample preparation method, enabled by FEI’s EasyLift EX Nanomanipulator, QuickFlip shuttle, and iFast automation software platform, delivers the highest throughput in the industry. Improved materials contrast enabled by new low-loss in-lens detectors, along with extreme high-resolution SEM imaging at low kV, ensures accurate endpointing, which results in increased yield during final thinning of the TEM sample. 
 
The combination of these unique features results in a >30% improvement in TEM lamella throughput over the Helios NanoLab 450 DualBeam. 
 
The world's most advanced DualBeam platform for imaging, analysis, and TEM sample preparation for semiconductor failure analysis, process development, and process control laboratories. 
 
The Helios NanoLab 460HP DualBeam combines the industry-leading, highest resolution and highest contrast Elstar+UC SEM with the most advanced Tomahawk FIB for best-in-class imaging and milling performance. Specifically designed for high-throughput, high-quality, ultra-thin TEM lamella preparation, the Helios 460HP DualBeam comes with FEI's EasyLift EX Nanomanipulator and QuickFlip shuttle for precise, accurate, and repeatable in situ sample lift-out and manipulations. When used in conjunction with FEI's iFast Starter Recipes for automated TEM sample preparation and Auto-LX™, designed for automated in situ lift-out and sample transfer to a TEM grid, even novice operators are able to repeatedly create high-quality, ultra-thin lamella with confidence. 
 
The Helios NanoLab 460HP DualBeam is designed to meet the challenges of advanced semiconductor FA labs. Accurately locate the defect in repeating structures using automated sample navigation with FEI's Cell Navigator. This improves the success rate of finding the intended region of interest by greater than 5%. In addition, the patented inverted TEM sample preparation method, enabled by FEI's EasyLift EX Nanomanipulator, QuickFlip shuttle and automation software platform iFAST, delivers the highest throughput in the industry. Finally, improved materials contrast enabled by new low-loss in-lens detectors along with extreme high resolution SEM imaging at low kV ensures accurate endpointing. This results in increased yield during final thinning of the TEM sample. 
 
The combination of these unique features results in a >30% improvement in TEM lamella throughput over the Helios NanoLab 450 DualBeam. 
 
Cross Section Imaging 
The innovative Elstar electron column with UC monochromator technology provides the foundation of the systems' unprecedented high-resolution imaging capability. This translates to uncompromised SEM resolution of 0.6nm at optimum working distance and 0.8nm at dual beam coincidence. High resolution, low damage electron beam imaging is critical for identifying defects or structural problems within the bulk sample and end-pointing on ultra-thin TEM lamella. Operating at very low landing energies is also critical to minimize beam induced damage on sensitive materials such as low k dielectric or photoresist.