FEI Company - Helios G4 CX DualBeam™
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Access the highest-resolution, multi-scale, and multi-modal subsurface and 3D information
Access the highest-resolution, multi-scale, and multi-modal subsurface and 3D information
Subsurface or three-dimensional characterization is often required to better understand the structure and properties of a sample. The latest technological innovations of the FEI Helios G4 CX DualBeam™ microscope, in combination with the easiest to use, most comprehensive software and FEI's application expertise, allow the Helios G4 CX DualBeam with optional AS&V4 software for the highest-quality, fully automated acquisition of multi-modal 3D datasets. Combined with FEI Avizo visualization software, it delivers a unique workflow solution for highest-resolution, advanced 3D characterization and analysis at nanometer scale.
Subsurface or three-dimensional characterization is often required to better understand the structure and properties of a sample. The latest technological innovations of the FEI Helios G4 CX DualBeam™ microscope, in combination with the easiest to use, most comprehensive software and FEI's application expertise, allow the Helios G4 CX DualBeam with optional AS&V4 software for the highest-quality, fully automated acquisition of multi-modal 3D datasets. Combined with FEI Avizo visualization software, it delivers a unique workflow solution for highest-resolution, advanced 3D characterization and analysis at nanometer scale.
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Features of Helios G4 CX DualBeam™
Experience the Advantages of the Helios G4 CX DualBeam
Fastest and easiest preparation of high-quality, site-specific TEM and APT samples using the Tomahawk ion column
Shortest time to nanoscale information using best-in-class Elstar™ electron column
The most complete sample information with sharp, refined, and charge-free contrast obtained from up to 7 integrated in-column and below-the-lens detectors.
The highest quality, multi-modal subsurface and 3D information with the most precise targeting of the region of interest using optional Auto Slice & View™ 4 (AS&V4) software.
Fast, accurate, and precise milling and deposition of complex structures with critical dimensions of less than 10 nm
Precise sample navigation tailored to individual application needs thanks to the high flexibility 110 mm stage and in-chamber Nav-Cam
Artifact-free imaging based on integrated sample cleanliness management and dedicated imaging modes such as SmartScan™
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