ULVAC - LASERPIT
Manufactured by ULVAC
Thermal Diffusivity Measurement System
Thermal conductivity evaluations of various films in the surface direction. This system measures surface direction thermal diffusivity of sheet materials by radiating laser alternatingly (Angstrom method). It is also capable of sub-micron thin film measurements for high-thermal conductivity films.
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Features of LASERPIT
Applications
Measurements of thermal diffusivity and thermal conductivity of high-thermal conductivity sheet materials (thickness 5 µm) such as copper, nickel, and stainless steel
Measurements of thermal diffusivity and thermal conductivity of low-thermal conductivity sheet materials (thickness 5 µm) and anisotropic high-thermal conductivity graphite sheets (thickness 1 µm) formed on glass substrates (thickness 0.03 mm)
Measurements of thermal conductivity of organic dye thin films (thickness 100 to 300 nm) formed on PET substrates (thickness 0.1 mm)
Evaluations of target materials for sputtering
Features
In-plane direction thermal diffusivity measurements of a broad range of sheet materials from diamond to polymers
Suited to materials with a broad range of shapes including 3 to 500 µm thick independent sheets, films, wires, and fibers.
Capable of measuring thermal conductivity of thin films 100 nm to 1000 nm thick formed on a substrate with the differential method * Room temperature only
General Specifications
There are no General Specifications available.