ULVAC - ARC PLASMA DEPOSITION

Manufactured by  ULVAC
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Low Cost PLD-Alternative

Pulsed Cathodic Arc Plasma Deposition is an innovative physical vapor technique that produces nanoparticles in vacuum without any gas inlet. By pulsing and varying the electrical inputs to the source, particle sizes can be controlled while the number of pulses determines the amount of material deposited. This control allows the formation of dense, flat high-purity thin films, or the coating of powders with nano-sized particles for catalyst work.
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Features of ARC PLASMA DEPOSITION

Applications for APD in Emerging Technologies   

  • PEM Fuel Cell Catalysts (Pt on Carbon) with high specific activity and durability at low wt% loadings   * Li-air Thin Film Batteries   * Nanometal Particle Inks   * Doping of Thermoelectric Materials   * Doping of CIGS PV   * Thin Film DLC / UNCD films   * Magnetic material coatings   

    Benefits of the Arc Plasma Method   * Can operate in UHV without the need for any gas inlet   * Digital control of deposition allows for film thickness to be controlled to the nm level   * Target material is highly ionized because it travels to the substrate through a strong plasma generated by the arc discharge of the source during each pulse of the deposition process   * Strongly ionized stream of coating material results in particles or films that have excellent adhesion to the substrate being coated   * Substrate temperature can be controlled anywhere from room temp to 350°C   * Catalysts made using this dry vacuum technique have high specific activity at low wt% loading and pristine surfaces with no residual chemical contaminants

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