TA Instruments - HP TGA 75/750

Manufactured by  TA Instruments
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The Worlds First Benchtop High Pressure TGA Featuring Patented Top Loading Magnetic Suspension Balance

TA Instruments invites you to experience two new high pressure thermogravimetric (HP-TGA) instruments, the Discovery HP-TGA 75 and HP-TGA 750. From the world leader in Magnetic Suspension Balance (MSB) technology for over 20 years comes an ingeniously designed, user-friendly top-loading microbalance with unprecedented performance. In addition, the Discovery HP-TGA's are the first available in a convenient benchtop design and feature on-board gas dosing and blending systems, temperature control to 1100°C, One-Touch-Away™ functionality, and TA's powerful TRIOS software. Getting great high pressure data has never been so easy!

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Features of HP TGA 75/750
  • Patented* top-loading magnetic levitation balance enables sealed environment for thermogravimetric testing in reactive atmospheres under high pressure (up to 80 bar) and high temperatures (up to 1100°C)

  • Unrivaled 0.1 Μg balance resolution provides the most accurate measurements of small samples or materials with rapid reaction kinetics

  • Top-loading balance design ensures superior weight stability at high temperature and pressure, and provides convenient access to sample for easy loading/unloading

  • Integrated gas dosing & pressure control eliminates need for a separate system and enables a compact footprint

  • Highly accurate balance temperature control for optimized baseline stability

  • Non-porous isolation material in contact with the reaction gas within the furnace eliminates potential retention of gases (“memory” effect) and enables rapid attainment of vacuum

  • Curie-point calibration eliminates the effects of the reaction gas type and pressure on the temperature measurement

  • Compact design puts high pressure TGA on the benchtop, minimizing valuable lab space requirements and enabling installation in a fume hood to easily manage ventilation when working with toxic gases

  • High heating and cooling rates (~250 K/min**), even under high pressure, reduces potential for unwanted side reactions and improves sample throughput

  • Small internal volume allows for rapid gas changes and quick pressurization, low gas consumption, and safe operational conditions due to the small quantity of compressed gas

  • European Patent: 1958323, U.S. Patent: 2009/0160279 Al, German Patent : DE 10 2015 116 767.0

** Cooling rate at ~250 K/min possible when at T ? 300°C

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