Bruker Optics - Rhazer
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Advanced Haze Removal System> – RAVE is once again pioneering another breakthrough in advanced equipment...
Haze contamination on photomasks has become a pervasive and costly problem throughout the Semiconductor Industry. Recent wet clean and environmental control techniques have helped to slow haze formation during wafer stepper exposures, but show no promise of a haze prevention solution.
The Rhazer® system does not prevent haze, but allows the wafer fab to “manage” it! The Rhazer® system is designed to reside in the wafer fab and provide a resident capability to reduce haze growth below printable levels from both sides of reticles in less than one working shift. The process is dry and does not require removal of the pellicle. Although haze is expected to reform, the Rhazer® process causes no damage to the mask absorber materials, no Transmission loss, no effect on critical CDs and no Overlay shift, meaning reticles can be cleaned as often as needed without leaving the control of the fab environment.
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Features of Rhazer
Time savings
Dry process – No pellicle removal * Fast-turn full reticle clean – One shift reticle turnaround * In-fab control – Reticles never leave the wafer fab * Fewer cleans – Negligible haze formation in storage
Cost-of-Ownership * Very low cost cleans * Fewer duplicate reticles needed * Reduced haze-related wafer losses * More efficient lithography line management
Extends Reticle Life * No absorber damage * No CD variance * No added chemical residues * Clean as often as needed
Green Technology * Small system footprint: 4.1 ft. x 7.6 ft. * Low energy consumption: 7kW @ 208V AC * No harmful effluents or waste management * No de-ionized water, acid or solvent wastes
Fully Automated Operation * SMIF compatible; RFID reader; OCR/Barcode reader * Robot; Reticle flipper, Pellicle height & edge detection * Highly user friendly GUI software and process control * SECS/GEM compatible
Mask Supplier Advantages * Return to time proven, highly efficient photomask cleaning technologies * Higher mask yields; Fewer re-clean losses * Faster delivery
General Specifications
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Additional Specifications
Haze Removal: 100% (Without Pellicle Removal)
System Throughput: < 8 hours (Frontside & Backside)
Mask Materials: Chrome, MoSi, Quartz.
Phase Angle Loss: None
Transmission Effect: None
Mask Size: 150mm x 150mm x 25mm