ZEISS - NEON® 60
Manufactured by ZEISS
No Documents
The NEON® 60 combines the GEMINI® technology with the full CrossBeam® functionality to yield an extremely powerful 3D analysis workstation.
The NEON® 60 combines the GEMINI® technology with the full CrossBeam® functionality to yield an extremely powerful 3D analysis workstation.
The NEON® 60 platform is the system of choice for bulky samples featuring a large chamber with 6'' stage and integrated 8'' airlock. The combination with the sophisticated Canion FIB column provides an integrated workstation, that opens up new dimensions for nanotechnology, semiconductor and material analysis applications.
The integral multi channel gas injection system adds material deposition and selective or enhanced etching facilities to the NEON® 60 CrossBeam® capabilities making it the ultimate analysis and inspection tool.
The refined 6-axes stage is a perfect complement to the high resolution capabilities of the NEON® 60 CrossBeam®. The stability of this super eucentric stage ensures perfect results on cutting edge applications such as device modifications, cross sections or TEM sample preparations.
The NEON® 60 platform is the system of choice for bulky samples featuring a large chamber with 6'' stage and integrated 8'' airlock. The combination with the sophisticated Canion FIB column provides an integrated workstation, that opens up new dimensions for nanotechnology, semiconductor and material analysis applications.
The integral multi channel gas injection system adds material deposition and selective or enhanced etching facilities to the NEON® 60 CrossBeam® capabilities making it the ultimate analysis and inspection tool.
The refined 6-axes stage is a perfect complement to the high resolution capabilities of the NEON® 60 CrossBeam®. The stability of this super eucentric stage ensures perfect results on cutting edge applications such as device modifications, cross sections or TEM sample preparations.
Active Questions & AnswersAsk a Question
There are no current Discussions
Electron Microscopes Service ProvidersView All (8)
Documents & Manuals
There are no Documents or Manuals available.
Features of NEON® 60
- Ultra high resolution FESEM with unique GEMINI® column
- Large 210 mm x 50 mm integrated airlock for fast specimen transfer
- Highly reliable pumping system, compatible with the toughest conditions
- High performance CANION FIB column as upgrade
- Multi-channel gas injection system with up to five gas lines for material deposition and enhanced or selective etching as upgrade
- CrossBeam® operation: high resolution live imaging during milling and polishing
- Endpoint detection for automated milling
- Automated TEM preparation software package
- Super eucentric, fully motorised, 6-axes stage with ultra fine controls and unsurpassed stability
- Image archiving, networking and hardcopy solutions from the integral Windows® operating system
General Specifications
There are no General Specifications available.
Series Modals
ZEISS - FIB
[+] View Model Specifications| Accelerating voltage | 2 to 30 kV |
| Electron Microscope Type | SEM-FIB |
| Field Emission | 1 |
| Probe Current | 1pA - 50nA |
| Microscope Type | Electron |
| Additional Model Specifications | Resolution:
7nm @ 30kV guaranteed, 5nm achievable Magnification: 600x - 500 kx Emitter: Ga liquid metal ion source (LMIS) Gas Injection System: Up to 5 gases for selective etching, enhanced etching, material deposition, insulator deposition [u]Detectors[/u] In-column: N/A In-lens: High Efficiency annular type (SE) Chamber: ET type (SE) BSD: Optional solid state or scintillator type STEM: Optional GEMINI® Multimode BF / DF detector 4QBSE: Optional Options: General purpose airlock / Micromanipulator for sample handling Specimen Chamber: 520 mm ø, 300 mm height 2 x IR CCD-camera included for sample viewing 8" large integrated airlock 210 x 50mm Specimen Stage: X = 152 mm, Y = 152mm Z = 43 mm, Z. = 10mm T = -15 - 65° R = 360° continuous Image Acquisition: Resolution: from 512 x 384 to 3072 x 2304 pixel, Processing: Pixel averaging, frame averaging, continuous averaging Image Display: Two 19’’ TFT monitors with image displayed at 1024 x 768 pixel System Control: Integrated CrossBeam®/SmartSEM® GUI based on Windows XP® operating system, controlled by mouse, control panel, keyboard and joystick |
ZEISS - SEM
[+] View Model Specifications| Accelerating voltage | 0.1 to 30 kV |
| Electron Microscope Type | SEM-FIB |
| Field Emission | 1 |
| Probe Current | 4 pA - 20 nA |
| Microscope Type | Electron |
| Additional Model Specifications | Resolution:
1.1 nm @ 20 kV 2.5 nm @ 1 kV Magnification: 20x - 900 kx Emitter: Schottky Field Emitter Gas Injection System: Up to 5 gases for selective etching, enhanced etching, material deposition, insulator deposition [u]Detectors[/u] In-column: N/A In-lens: High Efficiency annular type (SE) Chamber: ET type (SE) BSD: Optional solid state or scintillator type STEM: Optional GEMINI® Multimode BF / DF detector 4QBSE: Optional Options: General purpose airlock / Micromanipulator for sample handling Specimen Chamber: 520 mm ø, 300 mm height 2 x IR CCD-camera included for sample viewing 8" large integrated airlock 210 x 50mm Specimen Stage: X = 152 mm, Y = 152mm Z = 43 mm, Z. = 10mm T = -15 - 65° R = 360° continuous Image Acquisition: Resolution: from 512 x 384 to 3072 x 2304 pixel, Processing: Pixel averaging, frame averaging, continuous averaging Image Display: Two 19’’ TFT monitors with image displayed at 1024 x 768 pixel System Control: Integrated CrossBeam®/SmartSEM® GUI based on Windows XP® operating system, controlled by mouse, control panel, keyboard and joystick |