Leading semiconductor manufacturers use the Expida™ Wafer DualBeam™ systems for accurate 3D defect characterization and improved yields. Key applications include defect characterization, failure analysis and transmission electron microscope (TEM) sample preparation. The Expida line includes three full wafer DualBeam systems that accommodate near-fab semiconductor manufacturing support laboratories, and the 300mm full wafer capability of each microscope integrates flawlessly with inspection and control processes.  
  
Expida 1255S  
The Expida 1255S is the first and only integrated wafer DualBeam/STEM system that integrates wafer sample preparation, imaging and analysis for faster time to data and market. The Expida 1255S incorporates field-proven DualBeam technology, an STEM detector for 30kV STEM imaging and includes in-situ TEM sample lift-out and handling. Semiconductor labs can now prepare, image and analyze wafer samples in one system, with higher-throughput than ever before. The integrated Expida 1255S system extends the capabilities of the Expida family through improvements to the Sirion+™ electron column and a 14-segment STEM detector.   
  
Expida 1285  
The FEI Expida 1285 offers the ultimate in defect characterization, failure analysis and TEM sample preparation on patterned and unpatterned wafers. With fast and accurate 3D defect characterization, you get increased control and improved yield. The Expida 1285 includes an integrated front-end module designed to simultaneously handle 200mm and 300mm wafers using load port modules in addition to all of the performance specification of the Expida 1255S.  
  
Defect Analyzer 300HP   
The FEI Defect Analyzer 300HP (DA 300HP), built on the industry leading Expida platform offers an additional level of system automation. The DA 300HP offers customers all of the benefits of the 1255S with additional fully- and semi- automated use cases. Customers can perform automated defect redetection (ADR) as well as automated defect cross-sectioning (ADX).